meta-openembedded/meta-oe/recipes-devtools/lapack
Wang Mingyu c5b886b307
lapack: upgrade 3.10.1 -> 3.12.0
License-Update: Copyright year updated to 2023.

Signed-off-by: Wang Mingyu <wangmy@fujitsu.com>
Signed-off-by: Khem Raj <raj.khem@gmail.com>
2024-01-08 19:54:42 -08:00
..
lapack lapack: Add ptest support 2023-08-07 09:01:00 -07:00
lapack_3.12.0.bb lapack: upgrade 3.10.1 -> 3.12.0 2024-01-08 19:54:42 -08:00